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ZZ5186

    The ZZ5186 is a fully matched, a highly efficient, wide instantaneous bandwidth power amplifier (PA) with high gain and linearity. The PA is designed for FDD and TDD 4G LTE and 5G systems operating in the 3300MHz to 3600 MHz band. The device is manufactured using an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. The self-contained 5 mm x 5 mm x0.85 mm surface mount package incorporates RF matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.


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    The ZZ5186 is a fully matched, a highly efficient, wide instantaneous bandwidth power amplifier (PA) with high gain and linearity. The PA is designed for FDD and TDD 4G LTE and 5G systems operating in the 3300MHz to 3600 MHz band. The device is manufactured using an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. The self-contained 5 mm x 5 mm x0.85 mm surface mount package incorporates RF matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.


InGaP/GaAs HBT Technology, Fully Integrated, 3-Stage Power Amplifier

Wide instantaneous signal bandwidth: 100 MHz

High-efficiency: 25.5% PAE @ +28 dBm

High linearity: +28 dBm with < -50 dBc ACLR with DPD (100 MHz NR, 8.5 dB PAR signal)

Small Signal Gain: 31 dB

Single supply voltage: 5.0 V

Enable On/Off function: PAEN = 1.5 to 3.3 V

50Ω Input & Output Internally Matched

LGA(16-pin, 5 x 5 x 0.85 mm) package, RoHS Compliant

FDD and TDD 4G LTE and 5G systems

Supports 3GPP Bands 22, 42, n77 and n78

Customer Premises Equipment (CPE)

Driver amplifier for micro-base and macro-base stations

Enterprise small cell and massive MIMO


ZZ5186
The ZZ5186 is a fully matched, a highly efficient, wide instantaneous bandwidth power amplifier (PA) with high gain and linearity. The PA is designed for FDD and TDD 4G LTE and 5G systems operating in the 3300MHz to 3600 MHz band. The device is manufactured using an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. The self-contained 5 mm x 5 mm x0.85 mm surface mount package incorporates RF matching networks optimized for output pow
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(020)31137084

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佛山市南海区桂城街道平洲三山港口路23号宜安科创园3期25座801、802室

Copyright ©2026 All Rights Reserved 佛山臻智微芯科技有限公司 版权所有| 粤ICP备2025514614号

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